Photosensitive Polyimide Coatings Market - By Type: Negative-Tone PSPI, Positive-Tone PSPI, Dual-Function PSPI, Low-Cure PSPI; By Application: Semiconductor Packaging (RDL, Passivation), Displays (OLED, Flexible, Foldable), MEMS and Sensor Coatings, Printed Electronics, Others; By Region: North America, Europe, Asia-Pacific Latin America and Others
1 | Market Overview
Photosensitive polyimide (PSPI) coatings are specialized polymers that respond to UV exposure, enabling them to be patterned using photolithographic processes. These coatings combine the high thermal stability and chemical resistance of traditional polyimides with the processability of photoresists, rendering them highly suitable for advanced semiconductor packaging, flexible electronics, display panels, and microelectromechanical systems (MEMS).
As semiconductor geometries shrink and packaging complexity increases, PSPI materials are increasingly utilized in redistribution layers (RDL), passivation coatings, stress buffers, and insulation layers for flip-chip and wafer-level packaging. Their application is crucial in high-performance, space-constrained, and thermally demanding electronic environments.
2 | Market Size and Forecast
|
Year |
Market Value (USD Million) |
Notes |
|
2019 |
460 |
Used mainly in IC packaging and displays |
|
2024 |
610 |
CAGR 5.8% (2019–2024) |
|
2031 |
1,180 |
Projected CAGR 9.8% (2024–2031) |
3 | Primary Market Drivers
4 | Market Challenges
5 | Competitive Landscape
|
Company |
Est. 2024 Share |
Competitive Strengths |
Recent Move |
|
Toray Industries |
22% |
PSPI for RDL and wafer-level encapsulation |
Developed ultra-thin low-cure-temperature PSPI for AI processors |
|
Fujifilm Electronic Materials |
18% |
Advanced PSPI for display and MEMS |
Launched bendable PSPI for OLED foldables |
|
Hitachi Chemical (Showa Denko) |
14% |
Known for buffer coat PSPI for image sensors |
Expanded into 5G chip insulation solutions |
|
DuPont Electronics |
12% |
Multilayer PSPI for flip-chip and 3D ICs |
Introduced dual-function stress buffer and protective PSPI |
|
Others |
34% |
Regional fabs and display specialists |
Developing display, sensor, and wearable device applications |
6 | Market Segmentation
By Type
By Application
7 | Regional Analysis
8 | Technology and Innovation
9 | Regulatory Environment
Compliant with RoHS, REACH, and SEMI industry standards, electronic-grade PSPI must meet low metal contamination, dielectric performance, and thermal endurance requirements. Cleanroom packaging and traceability protocols are required for global fabs.
10 | Recent Developments (Q4 2023 – Q2 2025)
11 | Strategic Outlook
As demand for advanced packaging and flexible electronics continues to rise, photosensitive polyimide coatings are becoming indispensable in semiconductor and display fabrication. Material suppliers must balance flexibility, resolution, thermal durability, and ease of integration to support evolving customer needs. Collaborative development with foundries, OSATs, and panel manufacturers will unlock long-term growth.
12 | Methodology
Forecasts developed from models of photoresist and polyimide usage, alongside over 90 interviews with OSAT engineers and display manufacturers, as well as an analysis of PSPI material shipment trends. Adjusted for FOWLP adoption, foldable device penetration, and the rollout of 3D IC.
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