Report Code : CVMI2501268 | Published Date : March 3, 2025

1 | Market Overview

Photosensitive polyimide (PSPI) materials for electronic packaging are advanced polymers that facilitate high-resolution photopatterning while providing exceptional thermal, mechanical, and dielectric properties. These materials are essential in redistribution layers (RDL), stress buffers, insulating layers, and passivation films utilized in sophisticated IC packaging formats like flip-chip, fan-out wafer-level packaging (FOWLP), and 3D ICs.

The growing complexity of integrated circuits, along with miniaturization, requires polymer layers that can be precisely defined, tolerate extreme thermal cycling, and support multilayer interconnect architectures. PSPI materials provide high-aspect ratio patterning and are essential in enabling the shift toward heterogeneous integration and chiplet-based packaging.

 

2 | Market Size and Forecast

Year

Market Value (USD Million)

Notes

2019

310

Dominated by flip-chip packaging

2024

435

CAGR 7.0% (2019–2024)

2031

860

Projected CAGR 10.1% (2024–2031)

 

3 | Primary Market Drivers

  • Demand for thin, multilayer packaging in mobile and AI devices
  • Growth of advanced packaging methods like FOWLP and chiplets
  • Need for UV-curable, high thermal endurance insulating films
  • Compatibility with copper interconnects and low-k dielectrics

 

4 | Market Challenges

  • Complexity of dual-cure and multilayer PSPI processing
  • High raw material and cleanroom integration costs
  • Stringent reliability requirements in automotive and 5G applications
  • Limited vendor base for electronic packaging-grade PSPI

 

5 | Competitive Landscape

Company

Est. 2024 Share

Strengths in Packaging PSPI

Recent Development

Toray Industries

24%

Multilayer PSPI for high-speed I/O chips

Developed ultra-low CTE PSPI for chiplet interconnects

Fujifilm Electronic Materials

20%

RDL coatings for fan-out packaging

Launched stress-buffer PSPI for 3D NAND and logic stacking

Hitachi Chemical

16%

Image sensor packaging and passivation

Released PSPI with low-k compatibility for RF packaging

DuPont

12%

Known for dielectric control and curing tech

Introduced PSPI supporting sub-10µm pitch RDL lines

Others

28%

Local vendors and research-grade providers

Focusing on specific OSAT needs and MEMS applications

 

6 | Market Segmentation

By Cure Mechanism

  • Negative-Tone PSPI
  • Positive-Tone PSPI
  • Dual-Cure PSPI

 

By Application

  • Flip-Chip and Fan-Out Packaging – 40%
  • 3D IC and Heterogeneous Integration – XX%
  • CMOS Image Sensor Encapsulation – XX%
  • Automotive & RF Electronics – XX%
  • Others – XX%

 

7 | Regional Analysis

  • Asia-Pacific (60%) – Packaging foundries in Taiwan, China, and South Korea
  • North America (XX%) – R&D and fabless design in the US
  • Europe (XX%) – Automotive and RF packaging applications
  • Latin America (XX%) – Minor but rising OSAT presence
  • Middle East & Africa (XX%) – Small-scale test & sensor fab growth

 

8 | Technology and Innovation

  • Ultra-low coefficient of thermal expansion (CTE) PSPI for chip stacking
  • PSPI for fine-pitch (≤10μm) redistribution lines
  • Low-temperature curing systems compatible with hybrid bonding
  • Dual-function insulation/stress-buffer PSPI systems
  • PSPI with ultra-low outgassing for space-grade and automotive electronics

 

9 | Regulatory Environment

Must meet RoHS, REACH, and ISO 10993 for packaging materials in medical electronics. Conformance to IPC-4101 and JEDEC standards for reliability, cleanliness, and temperature cycling is critical for automotive and aerospace use cases.

 

10 | Recent Developments (Q4 2023 – Q2 2025)

  • Q4 2023 – Toray released PSPI for chiplet-based AI accelerator packaging
  • Q1 2024 – Fujifilm introduced PSPI for next-gen high-bandwidth memory integration
  • Q4 2024 – DuPont commercialized ultra-thin PSPI for stacked memory modules
  • Q2 2025 – Hitachi unveiled RF-compatible PSPI for automotive radar chips

 

11 | Strategic Outlook

With demand accelerating for high-density and low-power electronic packaging, photosensitive polyimide will remain a critical enabler of future chip architectures. Suppliers should focus on enhancing dielectric tunability, curing speed, and thermal management. Collaboration with OSATs, EDA tool providers, and substrate manufacturers will be crucial to unlocking new use cases.

 

12 | Methodology

Market forecasts are based on packaging material BOM analysis, wafer-level RDL and PSPI consumption metrics, and interviews with 75+ packaging engineers and substrate integrators. Adjusted for FOWLP, chiplet, and advanced RF packaging trajectories.





Reasons To Buy

Image



Scope

Image

Key Players

  • Toray Industries Inc.
  • DuPont
  • HD Microsystems
  • Fujifilm Holdings Corporation
  • Kolon Industries Inc.
  • SKC Co. Ltd.
  • UBE Corporation
  • PI Advanced Materials
  • Kaneka Corporation
  • Taimide Tech Inc.
  • Sumitomo Bakelite Co.Ltd.
  • Saint-Gobain
  • Hitachi Chemical Co. Ltd.
  • JSR Corporation
  • Mitsubishi Gas Chemical Company Inc.

Photosensitive Polyimide for Electronic Packaging Market Report


  1. 1. Photosensitive Polyimide for Electronic Packaging Market Research Report
    1. 1.1 Study Objectives
    2. 1.2 Photosensitive Polyimide for Electronic Packaging Market - Overview
    3. 1.3 Reason to Read This Report
    4. 1.4 Methodology and Forecast Analysis
  2. 2. Photosensitive Polyimide for Electronic Packaging Market Research Report - Preface
    1. 2.1 Photosensitive Polyimide for Electronic Packaging Market Research Report – Detailed Scope and Definitions
      1. 2.1.1 By Cure Mechanism
      2. 2.1.2 By Region
  3. 3. Photosensitive Polyimide for Electronic Packaging Market Dynamics
    1. 3.1. Drivers - Macro-Economic Based, Supply Side, and Demand Side Drivers
    2. 3.2. Restraints – By Cure Mechanism, By Country
    3. 3.3. Opportunities – By Cure Mechanism, By Country
    4. 3.4. Trends – By Cure Mechanism, By Country
    5. 3.5. PEST Analysis
    6. 3.6. Porters Five Rule Analysis
    7. 3.7. Company’s Share Analysis (CSA) by Region or By Country
    8. 3.8. Photosensitive Polyimide for Electronic Packaging Market Research Report – DROTs Impact Analysis
    1. 4. Photosensitive Polyimide for Electronic Packaging Market Research Report, Historic Data 2019 - 2023 and Forecast Analysis Data 2024 - 2031
    2. 4.1. Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
    3. 4.2. Annual Market Trend Assessment – Year-on-Year (YoY) Growth Analysis (%)
    4. 4.3. Incremental Market Value/Volume Opportunity between 2019 - 2023 and 2024 - 2031
    5. 4.4. Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
  1. 5. Photosensitive Polyimide for Electronic Packaging Market, By Cure Mechanism, 2019 - 2023 and Forecast, 2024 - 2031 (Market Value, In USD Mn)
    1. 5.1 Negative-Tone PSPI
    2. 5.1.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
    3. 5.1.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
    4. 5.1.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
    5. 5.1.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
    6. 5.2 Positive-Tone PSPI
    7. 5.2.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
    8. 5.2.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
    9. 5.2.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
    10. 5.2.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
    11. 5.3 Dual-Cure PSPI
    12. 5.3.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
    13. 5.3.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
    14. 5.3.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
    15. 5.3.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
  1. 6. Photosensitive Polyimide for Electronic Packaging Market Forecast, By Region, 2019 - 2023 and 2024 - 2031 (Market Value, In USD Mn)
    1. 6.1 North America
      1. 6.1.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
      2. 6.1.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
      3. 6.1.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
      4. 6.1.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
      6.2 Europe
      1. 6.2.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
      2. 6.2.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
      3. 6.2.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
      4. 6.2.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
      6.3 Asia-Pacific
      1. 6.3.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
      2. 6.3.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
      3. 6.3.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
      4. 6.3.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
      6.4 Latin America
      1. 6.4.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
      2. 6.4.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
      3. 6.4.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
      4. 6.4.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
      6.5 Middle East and Africa
      1. 6.5.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
      2. 6.5.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
      3. 6.5.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
      4. 6.5.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
      6.6 Photosensitive Polyimide for Electronic Packaging Market - Opportunity Analysis Index, By Cure Mechanism, and Region, 2024 - 2031
  1. 7. North America Photosensitive Polyimide for Electronic Packaging Market Analysis, 2019 - 2023 and Forecast, 2024 - 2031 (Market Value, In USD Mn)
    1. 7.1 By Cure Mechanism Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
      1. 7.1.1 Negative-Tone PSPI
      2. 7.1.2 Positive-Tone PSPI
      3. 7.1.3 Dual-Cure PSPI
      7.2 Country Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
      1. 7.2.1 United States
      2. 7.2.2 Canada
    2. 7.3 North America Photosensitive Polyimide for Electronic Packaging Market – Opportunity Analysis Index, By Cure Mechanism, and Country, 2024 - 2031
    3. 7.4 Regional Trends Analysis
    4. 7.5 North America Photosensitive Polyimide for Electronic Packaging Market Research Report - Company Profiles
      1. 7.5.1 Company 1 (United States)
      2. 7.5.2 Company 2 (Canada)
      3. 7.5.3 Company 3 (Canada)
    8. Europe Photosensitive Polyimide for Electronic Packaging Market Analysis, 2019 - 2023 and Forecast, 2024 - 2031 (Market Value, In USD Mn)
    1. 8.1 By Cure Mechanism Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
      1. 8.1.1 Negative-Tone PSPI
      2. 8.1.2 Positive-Tone PSPI
      3. 8.1.3 Dual-Cure PSPI
      8.2 Country Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
      1. 8.2.1 Germany
      2. 8.2.2 United Kingdom
      3. 8.2.3 France
      4. 8.2.4 Spain
      5. 8.2.5 Italy
      6. 8.2.6 Russia
    2. 8.3 Europe Photosensitive Polyimide for Electronic Packaging Market – Opportunity Analysis Index, By Cure Mechanism, and Country, 2024 - 2031
    3. 8.4 Regional Trends Analysis
    4. 8.5 Europe Photosensitive Polyimide for Electronic Packaging Market Research Report - Company Profiles
      1. 8.5.1 Company 1 (Germany)
      2. 8.5.2 Company 2 (United Kingdom)
      3. 8.5.3 Company 3 (United Kingdom)
    9. Asia-Pacific Photosensitive Polyimide for Electronic Packaging Market Analysis, 2019 - 2023 and Forecast, 2024 - 2031 (Market Value, In USD Mn)
    1. 9.1 By Cure Mechanism Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
      1. 9.1.1 Negative-Tone PSPI
      2. 9.1.2 Positive-Tone PSPI
      3. 9.1.3 Dual-Cure PSPI
      9.2 Country Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
      1. 9.2.1 China
      2. 9.2.2 Japan
      3. 9.2.3 India
      4. 9.2.4 South Korea
      5. 9.2.5 Australia & New Zealand
      6. 9.2.6 ASEAN
    2. 9.3 Asia-Pacific Photosensitive Polyimide for Electronic Packaging Market – Opportunity Analysis Index, By Cure Mechanism, and Country, 2024 - 2031
    3. 9.4 Regional Trends Analysis
    4. 9.5 Asia-Pacific Photosensitive Polyimide for Electronic Packaging Market Research Report - Company Profiles
      1. 9.5.1 Company 1 (China)
      2. 9.5.2 Company 2 (Japan)
      3. 9.5.3 Company 3 (Japan)
    10. Latin America Photosensitive Polyimide for Electronic Packaging Market Analysis, 2019 - 2023 and Forecast, 2024 - 2031 (Market Value, In USD Mn)
    1. 10.1 By Cure Mechanism Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
      1. 10.1.1 Negative-Tone PSPI
      2. 10.1.2 Positive-Tone PSPI
      3. 10.1.3 Dual-Cure PSPI
      10.2 Country Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
      1. 10.2.1 Brazil
      2. 10.2.2 Mexico
      3. 10.2.3 Argentina
      4. 10.2.4 Peru
      5. 10.2.5 Colombia
      6. 10.2.6 Rest of Latin America
    2. 10.3 Latin America Photosensitive Polyimide for Electronic Packaging Market – Opportunity Analysis Index, By Cure Mechanism, and Country, 2024 - 2031
    3. 10.4 Regional Trends Analysis
    4. 10.5 Latin America Photosensitive Polyimide for Electronic Packaging Market Research Report - Company Profiles
      1. 10.5.1 Company 1 (Brazil)
      2. 10.5.2 Company 2 (Mexico)
      3. 10.5.3 Company 3 (Mexico)
    11. Middle East and Africa Photosensitive Polyimide for Electronic Packaging Market Analysis, 2019 - 2023 and Forecast, 2024 - 2031 (Market Value, In USD Mn)
    1. 11.1 By Cure Mechanism Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
      1. 11.1.1 Negative-Tone PSPI
      2. 11.1.2 Positive-Tone PSPI
      3. 11.1.3 Dual-Cure PSPI
      11.2 Country Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
      1. 11.2.1 Saudi Arabia
      2. 11.2.2 UAE
      3. 11.2.3 South Africa
      4. 11.2.4 Egypt
      5. 11.2.5 Israel
      6. 11.2.6 Rest of Middle East and Africa
    2. 11.3 Middle East and Africa Photosensitive Polyimide for Electronic Packaging Market – Opportunity Analysis Index, By Cure Mechanism, and Country, 2024 - 2031
    3. 11.4 Regional Trends Analysis
    4. 11.5 Middle East and Africa Photosensitive Polyimide for Electronic Packaging Market Research Report - Company Profiles
      1. 11.5.1 Company 1 (Saudi Arabia)
      2. 11.5.2 Company 2 (UAE)
      3. 11.5.3 Company 3 (UAE)
    12. Competition Landscape
    1. 12.1 Strategic Dashboard of Top Market Players
    2. 12.2 Company Profiles (Introduction, Financial Assessments, Portfolio of Offerings, Milestones and Achievements, Strategic Initiative, and SWOT Analysis)
      1. 12.2.1 Toray Industries
      2. 12.2.2 DuPont
      3. 12.2.3 HD Microsystems
      4. 12.2.4 Fujifilm Holdings
      5. 12.2.5 Kolon Industries
      6. 12.2.6 SKC Co. Ltd.
      7. 12.2.7 UBE Corporation
      8. 12.2.8 PI Advanced Materials
      9. 12.2.9 Kaneka Corporation
      10. 12.2.10 Taimide Tech Inc.
      11. 12.2.11 Sumitomo Bakelite
      12. 12.2.12 Saint-Gobain
      13. 12.2.13 Hitachi Chemical
      14. 12.2.14 JSR Corporation
      15. 12.2.15 Mitsubishi Gas Chemical
  1. 13. Data Collection Method and Research Approach
  2. 14. Principal Presumptions and Acronyms