Report Code : CVMI2501269 | Published Date : March 3, 2025
1 | Market Overview
Photosensitive polyimides (PSPI) for the semiconductor market are advanced functional materials utilized for precise patterning and high-performance insulation in integrated circuits (ICs). These materials provide high thermal stability, low dielectric constants, and compatibility with lithographic techniques, making them essential in modern chip fabrication—especially for advanced nodes, logic chips, and memory devices.
As transistor densities increase and interconnect layers become more complex, PSPI materials are being used in key roles such as interlayer dielectric coatings, buffer layers, wafer passivation, and chip stacking. Their ability to be photodefined simplifies multi-step processes and supports ongoing scaling trends.
2 | Market Size and Forecast
Year |
Market Value (USD Million) |
Notes |
2019 |
390 |
Used in advanced logic and memory ICs |
2024 |
530 |
CAGR 6.4% (2019–2024) |
2031 |
1,020 |
Projected CAGR 9.5% (2024–2031) |
3 | Primary Market Drivers
- Adoption of advanced lithography and EUV processes
- Increased transistor density and interconnect complexity
- Demand for high-reliability packaging for AI, 5G, and HPC chips
- Compatibility of PSPI with copper interconnects and low-k materials
4 | Market Challenges
- High formulation and cleanroom processing costs
- Limited PSPI vendors qualified for sub-10nm production
- Thermal and mechanical stress under multilayer structures
- Integration issues with hybrid bonding and dielectric stacks
5 | Competitive Landscape
Company |
Est. 2024 Share |
Key Capabilities |
Recent Development |
Toray Industries |
22% |
EUV-compatible PSPI for FEOL/BEOL layers |
Released PSPI with ultra-low dielectric loss for HPC chips |
Fujifilm |
19% |
Memory-grade PSPI for multilayer DRAM/NAND |
Introduced spin-coatable PSPI for ultra-thin layers |
Hitachi Chemical |
14% |
Imaging sensor PSPI and passivation layers |
Launched PSPI optimized for TSV and wafer bonding |
DuPont |
12% |
Advanced node PSPI for logic fabs |
Commercialized hybrid-cure PSPI for sub-7nm logic applications |
Others |
33% |
Research fabs and foundry-specific suppliers |
Developing PSPI for SiP, RF modules, and sensor ICs |
6 | Market Segmentation
By Technology
- Front-End-of-Line (FEOL)
- Back-End-of-Line (BEOL)
- Through-Silicon Via (TSV)
- Interlayer Dielectric Applications
By Semiconductor Type
- Logic ICs – 39%
- Memory (DRAM/NAND) – XX%
- CMOS Image Sensors – XX%
- RF & Mixed Signal ICs – XX%
- Others – XX%
7 | Regional Analysis
- Asia-Pacific (62%) – IC foundries in Taiwan, South Korea, and China
- North America (XX%) – Leading in logic design and semiconductor R&D
- Europe (XX%) – Strong in automotive and sensor semiconductors
- Latin America (XX%) – Emerging role in chip testing and backend packaging
- Middle East & Africa (XX%) – Early-stage pilot fabs and R&D facilities
8 | Technology and Innovation
- Sub-10μm PSPI patterning for ultra-dense interconnects
- Low-stress, low-outgassing PSPI formulations for vacuum processes
- Multi-functional PSPI systems with thermal expansion control
- Self-planarizing PSPI for uneven topographies
- UV-curable PSPI for 3D and wafer-level integration
9 | Regulatory Environment
PSPI materials must meet RoHS, REACH, and ISO/JEDEC semiconductor standards. Cleanroom-grade handling, trace-metal control, and electrostatic safety are critical for fab qualification. Specialized PSPI used in image sensors must conform to low-ion migration standards.
10 | Recent Developments (Q4 2023 – Q2 2025)
- Q4 2023 – Toray introduced PSPI for 2.5D interposer structures in AI chips
- Q1 2024 – DuPont launched PSPI stack for sub-7nm logic IC integration
- Q4 2024 – Fujifilm expanded PSPI production line for DRAM/3D NAND fabs
- Q2 2025 – Hitachi developed PSPI optimized for advanced wafer bonding applications
11 | Strategic Outlook
As the semiconductor industry pushes toward heterogeneous integration, PSPI materials are poised to grow in both complexity and strategic value. Suppliers should focus on low-temperature cure systems, co-optimization with lithography tools, and expanded multilayer PSPI stacks. Long-term success will hinge on fab partnerships and rapid qualification cycles.
12 | Methodology
Forecasts based on IC wafer production data, PSPI layer usage trends, and interviews with over 80 semiconductor engineers and photomaterials scientists. Adjustments made for logic node scaling, memory layer increases, and advanced packaging adoption.
Reasons To Buy

Scope

Key Players
- Toray Industries Inc.
- DuPont
- Fujifilm Holdings Corporation
- HD Microsystems
- Kolon Industries Inc.
- SKC Co. Ltd.
- UBE Corporation
- PI Advanced Materials
- Kaneka Corporation
- Taimide Tech. Inc.
- Sumitomo Bakelite Co. Ltd.
- JSR Corporation
- Mitsui Chemicals Inc.
- Shin-Etsu Chemical Co. Ltd.
- Hitachi Chemical Co. Ltd.
Photosensitive Polyimide for Semiconductor Market Report
- 1. Photosensitive Polyimide for Semiconductor Market Research Report
- 1.1 Study Objectives
- 1.2 Photosensitive Polyimide for Semiconductor Market - Overview
- 1.3 Reason to Read This Report
- 1.4 Methodology and Forecast Analysis
- 2. Photosensitive Polyimide for Semiconductor Market Research Report - Preface
- 2.1 Photosensitive Polyimide for Semiconductor Market Research Report – Detailed Scope and Definitions
- 2.1.1 By Technology
- 2.1.2 By Semiconductor Type
- 2.1.3 By Region
- 2.1 Photosensitive Polyimide for Semiconductor Market Research Report – Detailed Scope and Definitions
- 3. Photosensitive Polyimide for Semiconductor Market Dynamics
- 3.1. Drivers - Macro-Economic Based, Supply Side, and Demand Side Drivers
- 3.2. Restraints – By Technology, By Semiconductor Type, By Country
- 3.3. Opportunities – By Technology, By Semiconductor Type, By Country
- 3.4. Trends – By Technology, By Semiconductor Type, By Country
- 3.5. PEST Analysis
- 3.6. Porters Five Rule Analysis
- 3.7. Company’s Share Analysis (CSA) by Region or By Country
- 3.8. Photosensitive Polyimide for Semiconductor Market Research Report – DROTs Impact Analysis
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- 4. Photosensitive Polyimide for Semiconductor Market Research Report, Historic Data 2019 - 2023 and Forecast Analysis Data 2024 - 2031
- 4.1. Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 4.2. Annual Market Trend Assessment – Year-on-Year (YoY) Growth Analysis (%)
- 4.3. Incremental Market Value/Volume Opportunity between 2019 - 2023 and 2024 - 2031
- 4.4. Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 5. Photosensitive Polyimide for Semiconductor Market, By Technology, 2019 - 2023 and Forecast, 2024 - 2031 (Market Value, In USD Mn)
- 5.1 Front-End-of-Line (FEOL)
- 5.1.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 5.1.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 5.1.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 5.1.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 5.2 Back-End-of-Line (BEOL)
- 5.2.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 5.2.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 5.2.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 5.2.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 5.3 Through-Silicon Via (TSV)
- 5.3.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 5.3.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 5.3.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 5.3.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 5.4 Interlayer Dielectric Applications
- 5.4.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 5.4.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 5.4.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 5.4.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 6.1 Logic ICs
- 6.1.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 6.1.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 6.1.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 6.1.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 6.2 Memory (DRAM/NAND)
- 6.2.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 6.2.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 6.2.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 6.2.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 6.3 CMOS Image Sensors
- 6.3.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 6.3.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 6.3.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 6.3.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 6.4 RF & Mixed Signal ICs
- 6.4.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 6.4.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 6.4.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 6.4.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 6.5 Others
- 6.5.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 6.5.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 6.5.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 6.5.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 7. Photosensitive Polyimide for Semiconductor Market Forecast, By Region, 2019 - 2023 and 2024 - 2031 (Market Value, In USD Mn)
- 7.1 North America
- 7.1.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 7.1.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 7.1.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 7.1.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 7.2.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 7.2.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 7.2.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 7.2.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 7.3.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 7.3.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 7.3.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 7.3.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 7.4.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 7.4.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 7.4.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 7.4.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 7.5.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 7.5.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 7.5.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 7.5.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 7.1 North America
- 8. North America Photosensitive Polyimide for Semiconductor Market Analysis, 2019 - 2023 and Forecast, 2024 - 2031 (Market Value, In USD Mn)
- 8.1 By Technology Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
- 8.1.1 Front-End-of-Line (FEOL)
- 8.1.2 Back-End-of-Line (BEOL)
- 8.1.3 Through-Silicon Via (TSV)
- 8.1.4 Interlayer Dielectric Applications
- 8.2.1 Logic ICs
- 8.2.2 Memory (DRAM/NAND)
- 8.2.3 CMOS Image Sensors
- 8.2.4 RF & Mixed Signal ICs
- 8.2.5 Others
- 8.3.1 United States
- 8.3.2 Canada
- 8.4 North America Photosensitive Polyimide for Semiconductor Market – Opportunity Analysis Index, By Technology, By Semiconductor Type, and Country, 2024 - 2031
- 8.5 Regional Trends Analysis
- 8.6 North America Photosensitive Polyimide for Semiconductor Market Research Report - Company Profiles
- 8.6.1 Company 1 (United States)
- 8.6.2 Company 2 (Canada)
- 8.6.3 Company 3 (Canada)
- 9.1 By Technology Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
- 9.1.1 Front-End-of-Line (FEOL)
- 9.1.2 Back-End-of-Line (BEOL)
- 9.1.3 Through-Silicon Via (TSV)
- 9.1.4 Interlayer Dielectric Applications
- 9.2.1 Logic ICs
- 9.2.2 Memory (DRAM/NAND)
- 9.2.3 CMOS Image Sensors
- 9.2.4 RF & Mixed Signal ICs
- 9.2.5 Others
- 9.3.1 Germany
- 9.3.2 United Kingdom
- 9.3.3 France
- 9.3.4 Spain
- 9.3.5 Italy
- 9.3.6 Russia
- 9.4 Europe Photosensitive Polyimide for Semiconductor Market – Opportunity Analysis Index, By Technology, By Semiconductor Type, and Country, 2024 - 2031
- 9.5 Regional Trends Analysis
- 9.6 Europe Photosensitive Polyimide for Semiconductor Market Research Report - Company Profiles
- 9.6.1 Company 1 (Germany)
- 9.6.2 Company 2 (United Kingdom)
- 9.6.3 Company 3 (United Kingdom)
- 10.1 By Technology Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
- 10.1.1 Front-End-of-Line (FEOL)
- 10.1.2 Back-End-of-Line (BEOL)
- 10.1.3 Through-Silicon Via (TSV)
- 10.1.4 Interlayer Dielectric Applications
- 10.2.1 Logic ICs
- 10.2.2 Memory (DRAM/NAND)
- 10.2.3 CMOS Image Sensors
- 10.2.4 RF & Mixed Signal ICs
- 10.2.5 Others
- 10.3.1 China
- 10.3.2 Japan
- 10.3.3 India
- 10.3.4 South Korea
- 10.3.5 Australia & New Zealand
- 10.3.6 ASEAN
- 10.4 Asia-Pacific Photosensitive Polyimide for Semiconductor Market – Opportunity Analysis Index, By Technology, By Semiconductor Type, and Country, 2024 - 2031
- 10.5 Regional Trends Analysis
- 10.6 Asia-Pacific Photosensitive Polyimide for Semiconductor Market Research Report - Company Profiles
- 10.6.1 Company 1 (China)
- 10.6.2 Company 2 (Japan)
- 10.6.3 Company 3 (Japan)
- 11.1 By Technology Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
- 11.1.1 Front-End-of-Line (FEOL)
- 11.1.2 Back-End-of-Line (BEOL)
- 11.1.3 Through-Silicon Via (TSV)
- 11.1.4 Interlayer Dielectric Applications
- 11.2.1 Logic ICs
- 11.2.2 Memory (DRAM/NAND)
- 11.2.3 CMOS Image Sensors
- 11.2.4 RF & Mixed Signal ICs
- 11.2.5 Others
- 11.3.1 Brazil
- 11.3.2 Mexico
- 11.3.3 Argentina
- 11.3.4 Peru
- 11.3.5 Colombia
- 11.3.6 Rest of Latin America
- 11.4 Latin America Photosensitive Polyimide for Semiconductor Market – Opportunity Analysis Index, By Technology, By Semiconductor Type, and Country, 2024 - 2031
- 11.5 Regional Trends Analysis
- 11.6 Latin America Photosensitive Polyimide for Semiconductor Market Research Report - Company Profiles
- 11.6.1 Company 1 (Brazil)
- 11.6.2 Company 2 (Mexico)
- 11.6.3 Company 3 (Mexico)
- 12.1 By Technology Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
- 12.1.1 Front-End-of-Line (FEOL)
- 12.1.2 Back-End-of-Line (BEOL)
- 12.1.3 Through-Silicon Via (TSV)
- 12.1.4 Interlayer Dielectric Applications
- 12.2.1 Logic ICs
- 12.2.2 Memory (DRAM/NAND)
- 12.2.3 CMOS Image Sensors
- 12.2.4 RF & Mixed Signal ICs
- 12.2.5 Others
- 12.3.1 Saudi Arabia
- 12.3.2 UAE
- 12.3.3 South Africa
- 12.3.4 Egypt
- 12.3.5 Israel
- 12.3.6 Rest of Middle East and Africa
- 12.4 Middle East and Africa Photosensitive Polyimide for Semiconductor Market – Opportunity Analysis Index, By Technology, By Semiconductor Type, and Country, 2024 - 2031
- 12.5 Regional Trends Analysis
- 12.6 Middle East and Africa Photosensitive Polyimide for Semiconductor Market Research Report - Company Profiles
- 12.6.1 Company 1 (Saudi Arabia)
- 12.6.2 Company 2 (UAE)
- 12.6.3 Company 3 (UAE)
- 13.1 Strategic Dashboard of Top Market Players
- 13.2 Company Profiles (Introduction, Financial Assessments, Portfolio of Offerings, Milestones and Achievements, Strategic Initiative, and SWOT Analysis)
- 13.2.1 Toray Industries
- 13.2.2 DuPont
- 13.2.3 Fujifilm Holdings
- 13.2.4 HD Microsystems
- 13.2.5 Kolon Industries
- 13.2.6 SKC Co. Ltd.
- 13.2.7 UBE Corporation
- 13.2.8 PI Advanced Materials
- 13.2.9 Kaneka Corporation
- 13.2.10 Taimide Tech Inc.
- 13.2.11 Sumitomo Bakelite
- 13.2.12 JSR Corporation
- 13.2.13 Mitsui Chemicals
- 13.2.14 Shin-Etsu Chemical
- 13.2.15 Hitachi Chemical Is this conversation helpful so far?
- 8.1 By Technology Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
- 14. Data Collection Method and Research Approach
- 15. Principal Presumptions and Acronyms