Report Code : CVMI2312256 | Published Date : March 3, 2025
The global circuit material market is undergoing significant transformation, driven by the rise of high-speed electronics, electric mobility, and miniaturization trends. Valued at USD 34.2 billion in 2023, the market is projected to reach USD 53.8 billion by 2031, growing at a CAGR of 5.8% ClearView Market Insights, 2024. Three major forces are influencing this growth trajectory:
High-Speed and High-Frequency Electronics Demand
- Rapid adoption of 5G, IoT, and advanced computing devices increasing the need for high-frequency circuit materials
- Emergence of advanced driver-assistance systems (ADAS) and EVs demanding low-loss, high-reliability materials
- Growth of flexible and wearable electronics requiring lightweight, high-performance substrates
Electric Mobility and Renewable Energy Expansion
- Surge in EV production spurring demand for thermal-resistant and high-power PCB materials
- Renewable energy systems (solar inverters, wind turbines) driving use of durable, high-temperature materials
- Electrification of industrial processes necessitating robust and efficient circuit material solutions
Miniaturization and Material Innovation
- Trend toward thinner, lighter, and multi-layered circuit boards in smartphones, tablets, and wearables
- High-density interconnect (HDI) and flexible PCB adoption propelling demand for specialized base materials
- Innovations in dielectric materials to support smaller form factors without performance compromise
Innovation Deep Dive
Advanced High-Performance Materials
Circuit materials are evolving to meet next-generation demands:
- Low-Loss Laminates and Prepregs:
- Enabling ultra-fast signal transmission for 5G and high-speed computing
- Superior dielectric properties and reduced signal attenuation
- Thermal Management Solutions:
- Materials with enhanced heat dissipation for EVs, servers, and power electronics
- Ceramic-filled and metal-backed laminates becoming mainstream
- Flexible and Stretchable Substrates:
- Innovation in polyimide and liquid crystal polymer (LCP) materials
- Expanding applications in medical devices, wearables, and foldable smartphones
Sustainability and Eco-Friendly Innovations
Green practices are reshaping circuit material production:
- Halogen-Free and RoHS-Compliant Materials:
- Increasing use of environmentally safe flame retardants
- Aligning with global electronic waste reduction regulations
- Bio-Based and Recyclable Substrates:
- Early-stage development of biodegradable circuit boards
- Focus on circular economy models in material production
- Energy-Efficient Manufacturing Processes:
- Adoption of low-energy curing resins and solvent-free laminates
- Reducing carbon footprints across the supply chain
Smart Material Integration
Circuit materials are getting smarter:
- Self-Healing Materials:
- Development of microcapsule-infused laminates for automatic crack repair
- Enhancing device longevity and reducing maintenance costs
- Embedded Sensors and Conductive Materials:
- Integration of sensing capabilities directly into circuit layers
- Applications in aerospace, defense, and industrial IoT devices
Industry-Specific Advancements
Automotive and Electric Vehicles
- High-Temperature PCB Materials:
- Resilient to elevated temperatures in EV powertrains and battery systems
- Lightweight, High-Strength Substrates:
- Supporting vehicle weight reduction initiatives and energy efficiency goals
Communications and Consumer Electronics
- 5G-Optimized Circuit Materials:
- Low-Dk, low-Df laminates for high-speed signal integrity
- Miniaturized, Multi-Layer Materials:
- Enabling smaller, faster, and more complex devices for the consumer market
Industrial and Renewable Applications
- High-Power and High-Voltage Materials:
- Supporting industrial automation, smart grids, and renewable energy systems
- Environmental Resistance:
- Materials designed to withstand harsh operational environments, including extreme humidity and temperature variations
Competitive Landscape
Market Leaders
Company |
Specialization |
2024 Initiative |
Market Share |
Panasonic Corporation |
Advanced circuit materials for automotive and electronics |
Expansion of halogen-free, high-frequency laminate portfolio |
18% |
Rogers Corporation |
High-performance RF and power electronics materials |
Launch of next-gen low-loss laminates for 5G |
15% |
Isola Group |
Specialty laminate and prepreg materials |
Development of ultra-low Dk materials for high-speed digital markets |
13% |
Emerging Disruptors
- Ventec International Group: Innovating in thermal management laminates for EVs and industrial electronics
- Taconic Advanced Dielectric Division: Pioneering PTFE-based materials for RF and microwave applications
- Arlon Electronic Materials: Focused on ruggedized, high-temperature circuit materials for aerospace and defense
Future Outlook
2024–2026
- Acceleration of eco-friendly and halogen-free material adoption across all sectors
- Expansion of flexible and stretchable circuit material offerings for wearables and foldable devices
2027–2029
- Widespread commercialization of self-healing and smart circuit materials
- New material standards emerging to support ultra-high-frequency (6G) communications
2030 and Beyond
- Integration of AI-designed materials for real-time performance optimization
- Universal use of recyclable and bio-based substrates in mainstream electronics manufacturing
Reasons To Buy

Scope

Key Players
- Rogers Corporation
- DuPont de Nemours
- Inc.
- Panasonic Corporation
- Arlon Electronic Materials
- Isola Group
Global Circuit Material Market Report
- 1. Global Circuit Material Market Research Report
- 1.1 Study Objectives
- 1.2 Global Circuit Material Market - Overview
- 1.3 Reason to Read This Report
- 1.4 Methodology and Forecast Analysis
- 2.1 Global Circuit Material Market Research Report – Detailed Scope and Definitions
- 2.1.1 By Material Type
- 2.1.2 By Application
- 2.1.3 By End-user
- 2.1.4 By Technology
- 2.1.5 By Region
- 3.1. Drivers - Macro-Economic Based, Supply Side, and Demand Side Drivers
- 3.2. Restraints – By Material Type, By Application, By End-user, By Technology, By Country
- 3.3. Opportunities – By Material Type, By Application, By End-user, By Technology, By Country
- 3.4. Trends – By Material Type, By Application, By End-user, By Technology, By Country
- 3.5. PEST Analysis
- 3.6. Porters Five Rule Analysis
- 3.7. Company’s Share Analysis (CSA) by Region or By Country
- 3.8. Global Circuit Material Market Research Report – DROTs Impact Analysis
- 4.1. Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 4.2. Annual Market Trend Assessment – Year-on-Year (YoY) Growth Analysis (%)
- 4.3. Incremental Market Value/Volume Opportunity between 2019 - 2023 and 2024 - 2031
- 4.4. Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 5.1 Polymer
- 5.1.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 5.1.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 5.1.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 5.1.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 5.2 Ceramic
- 5.2.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 5.2.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 5.2.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 5.2.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 5.3 Glass
- 5.3.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 5.3.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 5.3.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 5.3.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 6.1 PCBs
- 6.1.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 6.1.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 6.1.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 6.1.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 6.2 IC Substrates
- 6.2.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 6.2.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 6.2.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 6.2.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 6.3 RFID Tags
- 6.3.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 6.3.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 6.3.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 6.3.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 7.1 Electronics
- 7.1.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 7.1.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 7.1.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 7.1.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 7.2 Automotive
- 7.2.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 7.2.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 7.2.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 7.2.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 7.3 Aerospace
- 7.3.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 7.3.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 7.3.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 7.3.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 7.4 Others
- 7.4.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 7.4.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 7.4.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 7.4.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 8.1 Multilayer
- 8.1.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 8.1.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 8.1.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 8.1.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 8.2 Single-layer
- 8.2.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 8.2.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 8.2.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 8.2.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 8.3 Flexible Circuits.
- 8.3.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 8.3.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 8.3.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 8.3.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 9.1 North America
- 9.1.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 9.1.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 9.1.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 9.1.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 9.2 Europe
- 9.2.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 9.2.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 9.2.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 9.2.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 9.3 Asia-Pacific
- 9.3.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 9.3.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 9.3.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 9.3.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 9.4 Latin America
- 9.4.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 9.4.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 9.4.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 9.4.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 9.5 Middle East & Africa
- 9.5.1 Market Performance Review & Future Outlook: Assessing 2019 - 2023 and Predicting 2024 - 2031 Trends (USD Millions)
- 9.5.2 Annual Market Trend Assessment – Yearly Growth Observation (Y-O-Y)(%)
- 9.5.3 Incremental Market Value/Volume Opportunity between 2019 - 2023 and From 2024 to 2031
- 9.5.4 Market Shares Analysis in Years - 2019, 2023, 2024 and 2031
- 9.6 Global Circuit Material Market - Opportunity Analysis Index, By Material Type, By Application, By End-user, By Technology, and Region, 2024 - 2031
- 10.1 By Material Type Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
- 10.1.1 Polymer
- 10.1.2 Ceramic
- 10.1.3 Glass
- 10.2.1 PCBs
- 10.2.2 IC Substrates
- 10.2.3 RFID Tags
- 10.3.1 Electronics
- 10.3.2 Automotive
- 10.3.3 Aerospace
- 10.3.4 Others
- 10.4.1 Multilayer
- 10.4.2 Single-layer
- 10.4.3 Flexible Circuits.
- 10.5.1 United States
- 10.5.2 Canada
10.7 Regional Trends Analysis
10.8 North America Global Circuit Material Market Research Report - Company Profiles- 10.8.1 Company 1 (United States)
- 10.8.2 Company 2 (Canada)
- 10.8.3 Company 3 (Canada)
- 11.1 By Material Type Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
- 11.1.1 Polymer
- 11.1.2 Ceramic
- 11.1.3 Glass
- 11.2.1 PCBs
- 11.2.2 IC Substrates
- 11.2.3 RFID Tags
- 11.3.1 Electronics
- 11.3.2 Automotive
- 11.3.3 Aerospace
- 11.3.4 Others
- 11.4.1 Multilayer
- 11.4.2 Single-layer
- 11.4.3 Flexible Circuits.
- 11.5.1 Germany
- 11.5.2 United Kingdom
- 11.5.3 France
- 11.5.4 Spain
- 11.5.5 Italy
- 11.5.6 Russia
- 11.5.7 Netherlands
- 11.5.8 Poland
- 11.5.9 Rest of Europe
11.7 Regional Trends Analysis
11.8 Europe Global Circuit Material Market Research Report - Company Profiles- 11.8.1 Company 1 (Germany)
- 11.8.2 Company 2 (United Kingdom)
- 11.8.3 Company 3 (United Kingdom)
- 12.1 By Material Type Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
- 12.1.1 Polymer
- 12.1.2 Ceramic
- 12.1.3 Glass
- 12.2.1 PCBs
- 12.2.2 IC Substrates
- 12.2.3 RFID Tags
- 12.3.1 Electronics
- 12.3.2 Automotive
- 12.3.3 Aerospace
- 12.3.4 Others
- 12.4.1 Multilayer
- 12.4.2 Single-layer
- 12.4.3 Flexible Circuits.
- 12.5.1 China
- 12.5.2 Japan
- 12.5.3 India
- 12.5.4 South Korea
- 12.5.5 Australia & NZ
- 12.5.6 ASEAN
- 12.5.7 Rest of Asia-Pacific
12.7 Regional Trends Analysis
12.8 Asia-Pacific Global Circuit Material Market Research Report - Company Profiles- 12.8.1 Company 1 (China)
- 12.8.2 Company 2 (Japan)
- 12.8.3 Company 3 (Japan)
- 13.1 By Material Type Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
- 13.1.1 Polymer
- 13.1.2 Ceramic
- 13.1.3 Glass
- 13.2.1 PCBs
- 13.2.2 IC Substrates
- 13.2.3 RFID Tags
- 13.3.1 Electronics
- 13.3.2 Automotive
- 13.3.3 Aerospace
- 13.3.4 Others
- 13.4.1 Multilayer
- 13.4.2 Single-layer
- 13.4.3 Flexible Circuits.
- 13.5.1 Brazil
- 13.5.2 Mexico
- 13.5.3 Argentina
- 13.5.4 Peru
- 13.5.5 Colombia
- 13.5.6 Rest of Latin America
13.7 Regional Trends Analysis
13.8 Latin America Global Circuit Material Market Research Report - Company Profiles- 13.8.1 Company 1 (Brazil)
- 13.8.2 Company 2 (Mexico)
- 13.8.3 Company 3 (Mexico)
- 14.1 By Material Type Analysis 2019 - 2023 and Forecast, 2024 - 2031 by Market Assessment (USD Mn), Yearly Growth Rate (%), and Market Presence (%)
- 14.1.1 Polymer
- 14.1.2 Ceramic
- 14.1.3 Glass
- 14.2.1 PCBs
- 14.2.2 IC Substrates
- 14.2.3 RFID Tags
- 14.3.1 Electronics
- 14.3.2 Automotive
- 14.3.3 Aerospace
- 14.3.4 Others
- 14.4.1 Multilayer
- 14.4.2 Single-layer
- 14.4.3 Flexible Circuits.
- 14.5.1 Saudi Arabia
- 14.5.2 UAE
- 14.5.3 South Africa
- 14.5.4 Egypt
- 14.5.5 Israel
- 14.5.6 Rest of Middle East and Africa
14.7 Regional Trends Analysis
14.8 Middle East & Africa Global Circuit Material Market Research Report - Company Profiles- 14.8.1 Company 1 (Saudi Arabia)
- 14.8.2 Company 2 (UAE)
- 14.8.3 Company 3 (UAE)
- 15.1 Strategic Dashboard of Top Market Players
15.2 Company Profiles (Introduction, Financial Assessments, Portfolio of Offerings, Milestones and Achievements, Strategic Initiative, and SWOT Analysis)- 15.2.1 Rogers Corporation
- 15.2.2 DuPont de Nemours
- 15.2.3 Inc.
- 15.2.4 Panasonic Corporation
- 15.2.5 Arlon Electronic Materials
- 15.2.6 Isola Group
17. Principal Presumptions and Acronyms